WAFER POLISHING HEAD

The present invention relates to a wafer polishing head which comprises: a head main body; a membrane positioned below the head main body and having a protrusion in a direction of coming in contact with a wafer; a retainer ring positioned below the head main body to surround a periphery of the wafer...

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Bibliographic Details
Main Authors BOO, JAE PHIL, LEE KYU HA
Format Patent
LanguageEnglish
Korean
Published 30.08.2022
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:The present invention relates to a wafer polishing head which comprises: a head main body; a membrane positioned below the head main body and having a protrusion in a direction of coming in contact with a wafer; a retainer ring positioned below the head main body to surround a periphery of the wafer and the membrane; and a chuck plate positioned between the head main body and the membrane. The chuck plate can be moved between the head main body and the membrane. 본 발명은 웨이퍼 연마 헤드에 있어서, 헤드 본체; 헤드 본체 아래에 위치하는 멤브레인;으로서, 웨이퍼와 접촉하는 방향에 돌기를 포함하는 멤브레인; 헤드 본체 아래에 위치하여 웨이퍼와 멤브레인의 주위를 감싸는 리테이너 링; 및 헤드 본체와 멤브레인 사이에 위치하는 척 플레이트;를 포함하며, 척 플레이트는 헤드 본체와 멤브레인 사이에서 이동 가능한 웨이퍼 연마 헤드에 대한 것이다.
Bibliography:Application Number: KR20210023892