CHIPLET INTERPOSER

Embodiments include packages and methods for forming the packages that include interposers having a substrate made of a dielectric material. The interposers may also include a redistribution structure on a substrate. The redistribution structure includes metallization patterns that are stitched toge...

Full description

Saved in:
Bibliographic Details
Main Authors YU CHEN HUA, HOU SHANG YUN, CHEN WEIMING CHRIS, TING KUO CHIANG, HU HSIEN PIN, CHIOU WEN CHIH
Format Patent
LanguageEnglish
Korean
Published 19.08.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Embodiments include packages and methods for forming the packages that include interposers having a substrate made of a dielectric material. The interposers may also include a redistribution structure on a substrate. The redistribution structure includes metallization patterns that are stitched together in a patterning process that includes multiple lateral overlapping patterning exposures. 실시예들은 유전체 물질로 제조된 기판을 갖는 인터포저들을 포함하는 패키지들을 형성하기 위한 방법들과 패키지들을 포함한다. 인터포저들은 또한 기판 위에 재배선 구조물을 포함할 수 있고, 재배선 구조물은 다중 횡측 중첩 패터닝 노광들을 포함하는 패터닝 공정에서 함께 스티칭되는 금속화 패턴들을 포함한다.
Bibliography:Application Number: KR20210101827