POLYIMIDE RESIN AND POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPRISING THE SAME

An exemplary embodiment of the present application provides a polyimide resin including a structure represented by a chemical formula 1, and a positive photosensitive resin composition containing the same. The polyimide resin according to an exemplary embodiment of the present application, by includ...

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Bibliographic Details
Main Authors LIM HYUNSOON, SUNG JIYEON, LIM MINYOUNG
Format Patent
LanguageEnglish
Korean
Published 11.08.2022
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:An exemplary embodiment of the present application provides a polyimide resin including a structure represented by a chemical formula 1, and a positive photosensitive resin composition containing the same. The polyimide resin according to an exemplary embodiment of the present application, by including an acetylacetone group in the polyimide resin, can improve adhesion strength with metal even when no additional additive is added. 본 출원의 일 실시상태는 화학식 1로 표시되는 구조를 포함하는 폴리이미드 수지 및 이를 포함하는 포지티브형 감광성 수지 조성물을 제공한다.
Bibliography:Application Number: KR20220002815