POLYIMIDE RESIN AND POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPRISING THE SAME

In one embodiment of the present application, provided is a polyimide resin having at least one terminal to which a functional group represented by a chemical formula 1 or 2 is bonded. Since the polyimide resin according to an exemplary embodiment of the present application contains a functional gro...

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Bibliographic Details
Main Authors SUNG JIYEON, LIM MINYOUNG
Format Patent
LanguageEnglish
Korean
Published 11.08.2022
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:In one embodiment of the present application, provided is a polyimide resin having at least one terminal to which a functional group represented by a chemical formula 1 or 2 is bonded. Since the polyimide resin according to an exemplary embodiment of the present application contains a functional group with excellent adhesion to metal in the polyimide resin, it is possible to improve the adhesion strength to the metal. 본 출원의 일 실시상태는, 폴리이미드 수지의 적어도 하나의 말단에 화학식 1 또는 2로 표시되는 작용기가 결합된 것인 폴리이미드 수지를 제공한다.
Bibliography:Application Number: KR20210015810