CHEMICAL SOLUTION USED FOR CLEANING OR ETCHING RUTHENIUM-CONTAINING LAYER AND METHOD FOR FABRICATING RUTHENIUM WIRING

Provided are: a chemical solution used for cleaning or etching a ruthenium-containing layer, which is capable of obtaining a ruthenium-containing layer with reduced surface roughness while maintaining a good etching rate against ruthenium; and a method for manufacturing ruthenium wiring using the ch...

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Bibliographic Details
Main Authors TAKAHASHI KAZUHIRO, WADA YUKIHISA, KOGA SHINYA
Format Patent
LanguageEnglish
Korean
Published 10.08.2022
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Summary:Provided are: a chemical solution used for cleaning or etching a ruthenium-containing layer, which is capable of obtaining a ruthenium-containing layer with reduced surface roughness while maintaining a good etching rate against ruthenium; and a method for manufacturing ruthenium wiring using the chemical solution. The chemical solution according to the present invention comprises: orthoperiodic acid (A); a basic component (B); and a compound (C) selected from the group consisting of a nitrogen-containing heterocyclic compound, an organic phosphonic acid, and an organic carboxylic acid. (과제) 루테늄에 대한 양호한 에칭 레이트를 유지하면서, 표면 러프니스가 저감된 루테늄 함유층을 얻을 수 있는, 루테늄 함유층을 세정 또는 에칭하기 위해서 사용되는 약액, 및 당해 약액을 사용한 루테늄 배선의 제조 방법을 제공한다. (해결 수단) 오르토과요오드산 (A) 와, 염기 성분 (B) 와, 함질소 복소 고리 화합물, 유기 포스폰산, 및 유기 카르복실산으로 이루어지는 군에서 선택되는 화합물 (C) 를 포함하는, 루테늄 함유층을 세정 또는 에칭하기 위해서 사용되는 약액을 사용한다.
Bibliography:Application Number: KR20220007284