METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE SUBSTRATE PROCESSING METHOD SUBSTRATE PROCESSING APPARATUS AND PROGRAM

• Main Authors: FUJI TOMOKI, HASHIMOTO YOSHITOMO, YAMASHITA HIROKI
• Format: Patent
• Language: English; Korean
• Published: 05.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The present invention provides a technique capable of forming a high-quality film at a high film formation rate in a concave part provided on the surface of a substrate. A manufacturing method of a semiconductor device comprises: (a) a process of supplying a raw material to a substrate having a conc...