POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHOD OF SUBSTRATE

An embodiment provides a polishing composition for semiconductor processing, a method for polishing a substrate to which the polishing composition is applied, and the like. The polishing composition for semiconductor processing with improved polishing rate, selectivity, and the like, and improved di...

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Main Authors LEE HYEONG JU, JIN GYU AN, KIM JONG WOO, HAN DEOK SU, HONG SEUNG CHUL, KIM HWAN CHUL, PARK HAN TEO
Format Patent
LanguageEnglish
Korean
Published 06.07.2022
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SEMICONDUCTOR DEVICES
SKI WAXES
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Summary:An embodiment provides a polishing composition for semiconductor processing, a method for polishing a substrate to which the polishing composition is applied, and the like. The polishing composition for semiconductor processing with improved polishing rate, selectivity, and the like, and improved dispersibility can be provided. In addition, a method for producing a substrate polished by applying the polishing composition for semiconductor processing can be provided. 구현예는 반도체 공정용 연마 조성물, 연마 조성물을 적용한 기판의 연마방법 등을 제공한다. 연마율, 선택비 등이 향상되고, 분산성이 향상된 반도체공정용 연마 조성물을 제공할 수 있고, 이 반도체공정용 연마 조성물을 적용하여 연마된 기판을 제조하는 방법을 제공할 수 있다.
Bibliography:Application Number: KR20200185626