LIGHT EMITTING DEVICE PACKAGE

• Main Authors: SONG JUNE O, KIM KI SEOK, KIM WON JUNG, LIM CHANG MAN
• Format: Patent
• Language: English; Korean
• Published: 07.06.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

실시예에 따른 발광소자 패키지는 서로 이격되어 배치되는 복수의 프레임; 상기 복수의 프레임을 지지하는 몸체; 상기 몸체 상에 배치되며, 각각이 상기 복수의 프레임 중 서로 인접한 2개의 프레임에 전기적으로 접속되는 복수의 발광소자; 및 상기 몸체와 상기 발광소자 사이에 배치되어 상기 발광소자의 외측으로 연장되는 제1 수지부를 포함할 수 있다. According to an embodiment of the present invention, a light-emitting device package includes: a first frame and a second frame spaced apart from each other; a third frame disposed between the first frame and the second frame and spaced apart from the first frame and the second frame; a body supporting the first to third frames; a first light-emitting device disposed on the body and electrically connected to the first frame and the third frame; and a second light-emitting device disposed on the body and electrically connected to the second frame and the third frame. The body may include a first recess in an upper region between the first frame and the third frame, and a second recess in an upper region between the third frame and the second frame. The embodiment may include a first resin portion disposed in the first recess and a second resin portion disposed in the second recess. The first light-emitting device includes a first bonding portion and a second bonding portion and is disposed on the first resin portion to be electrically connectable to the first frame and the third frame. The second light-emitting device includes a third bonding portion and a fourth bonding portion and is disposed on the second resin portion to be electrically connectable to the second frame and the third frame. Thus, the bonding force between a package body and a light-emitting device can be improved.