SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE

According to the embodiments of the present invention, provided are a semiconductor device with improved operation reliability and a fabricating method of the semiconductor device. According to the present technology, provided is the semiconductor device comprising: a cell laminated body including f...

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Bibliographic Details
Main Author JAE TAEK KIM
Format Patent
LanguageEnglish
Korean
Published 31.05.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:According to the embodiments of the present invention, provided are a semiconductor device with improved operation reliability and a fabricating method of the semiconductor device. According to the present technology, provided is the semiconductor device comprising: a cell laminated body including first cell lamination layers and laminated conductive layers alternately laminated with each other; a cell plug penetrating the cell laminated body; and a cell chip guard surrounding the cell laminated body and the cell plug. The cell chip guard includes a guard semiconductor layer and a guard insulating layer covering a sidewall of the guard semiconductor layer. 본 기술은 서로 교대로 적층된 제1 셀 적층막들 및 적층 도전막들을 포함하는 셀 적층체; 상기 셀 적층체를 관통하는 셀 플러그; 및 상기 셀 적층체 및 상기 셀 플러그를 둘러싸는 셀 칩 가드를 포함하고, 상기 셀 칩 가드는 가드 반도체막 및 상기 가드 반도체막의 측벽을 덮는 가드 절연막을 포함하는 반도체 장치를 제공한다.
Bibliography:Application Number: KR20200158815