Electroplating Radioisotope Apparatus for Manufacturing Betavoltaic Battery

• Main Authors: PARK DONG YEOL, GU TAE HUN, HAN DEOK WOO, PARK WAN WOO
• Format: Patent
• Language: English; Korean
• Published: 31.05.2022
• Subjects: APPARATUS THEREFOR; APPLICATIONS OF RADIATION FROM RADIOACTIVE SOURCES, NOTOTHERWISE PROVIDED FOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; NUCLEAR ENGINEERING; NUCLEAR PHYSICS; OBTAINING ENERGY FROM RADIOACTIVE SOURCES; PHYSICS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; UTILISING COSMIC RADIATION

The present invention relates to a radioisotope electroplating apparatus for manufacturing a betavoltaic battery, comprising a plating bath for accommodating a plating solution containing a radioisotope for manufacturing a betavoltaic battery; an anode unit coupled to the plating bath to be arranged in an accommodating space where the plating solution is accommodated in the plating bath; a cathode unit supporting a supporting surface of a substrate arranged on the opposite side of a deposition surface so that the deposition surface of the substrate for depositing a radioisotope is entirely in contact with the plating solution; a main body to which the cathode unit is coupled; and an adsorption unit making the substrate supported on the cathode unit to adhere to the cathode unit by using adsorption force. According to the present invention, a plating layer can be formed on the entire surface of the deposition surface of the substrate, and therefore, the yield of the electroplating process can be improved. 본 발명은 베타전지를 제조하기 위한 방사성 동위원소가 포함된 도금액을 수용하기 위한 도금조; 상기 도금조에서 도금액이 수용되는 수용공간에 배치되도록 상기 도금조에 결합된 양극부; 방사성 동위원소를 증착하기 위한 기판의 증착면의 전면(全面)이 상기 도금액에 접촉되도록 상기 증착면의 반대쪽에 배치된 기판의 지지면을 지지하는 음극부; 상기 음극부가 결합된 본체부; 및 흡착력을 이용하여 상기 음극부에 지지된 기판을 상기 음극부에 부착시키는 흡착부를 포함하는 베타전지 제조용 방사성 동위원소 전기도금장치에 관한 것이다.