SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

The objective of the present invention is to improve the performance of a semiconductor device. The semiconductor device comprises: a wiring substrate; a semiconductor chip (CHP1) mounted on the wiring substrate; a heat-dissipating sheet (TIM) disposed on the semiconductor chip (CHP1) to cover the e...

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Bibliographic Details
Main Authors TANUMA YUSUKE, AKIBA TOSHIHIKO
Format Patent
LanguageEnglish
Korean
Published 27.05.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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