PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM PREPARED THEREFROM

• Main Authors: KWON JIN, LEE KYU CHEOL
• Format: Patent
• Language: English; Korean
• Published: 26.05.2022
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP

According to a photosensitive resin composition of the present invention, it is possible to prepare a cured film having excellent resolution by adjusting developability and improving a crosslinking reaction while being sufficiently cured even at a low temperature by improving the degree of curing. In the photosensitive resin composition of the present invention, a first copolymer and a second copolymer are used as binders so as to introduce an appropriate amount of succinate and epoxy groups thereinto. Furthermore, the composition improves chemical resistance to chemical solvents or cleaning solvents, thereby being able to prevent deformation of the cured film. 본 발명의 감광성 수지 조성물은 제1 공중합체 및 제2 공중합체를 바인더로 사용해 조성물 내 숙시네이트기 및 에폭시기를 적정량 도입함으로써, 경화도를 향상시켜 저온에서도 충분히 경화될 수 있으면서도 현상성 조절 및 가교반응 향상을 통해 우수한 해상도를 갖는 경화막을 제조할 수 있다. 나아가, 상기 조성물은 화학 용매나 클리닝 용매 등에 대한 내화학성을 향상시켜 경화막의 변형을 방지할 수 있다.