The wafer bonding device

The present invention provides a wafer joint device that can accurately control the bending state and parallelism of a wafer to be joined, suppress the positional deviation due to the strain of the wafer, perform high-precision bonding and void-free joining, and improve productivity by monitoring th...

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Bibliographic Details
Main Authors MOROISHI FUMITAKA, SUGIURA TAKAMASA, KAJINAMI MASATO
Format Patent
LanguageEnglish
Korean
Published 24.05.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention provides a wafer joint device that can accurately control the bending state and parallelism of a wafer to be joined, suppress the positional deviation due to the strain of the wafer, perform high-precision bonding and void-free joining, and improve productivity by monitoring the joining status of the wafer. A wafer joint device (100) includes: a first chuck (101) with a hole in the center of a surface holding a wafer; a second chuck (102); a pressing portion (103-1) for pressing the wafer in a direction of the second chuck (102) through the hole; and an air bearing (104) provided between the pressing portion (103-1) and the first chuck (101) to suppress the positional deviation of the pressing portion (103-1) in a holding surface direction. 접합하는 웨이퍼의 만곡 상태, 평행도를 정확하게 제어하고, 웨이퍼의 왜곡에 의한 위치 어긋남을 억제하며, 고정밀도의 본딩과 보이드가 없는 접합이 가능하고, 또한 웨이퍼의 접합 상황을 감시하는 것에 의해 생산성을 향상시킬 수 있는 웨이퍼 접합 장치를 제공하기 위해, 웨이퍼 접합 장치(100)는 웨이퍼를 유지하는 면의 중앙에 구멍을 갖는 제 1 척(101)과, 제 2 척(102)과, 구멍을 통해 웨이퍼를 제 2 척(102) 방향으로 압압하는 압압부(103-1)와, 압압부(103)와 제 1 척(101) 사이에 마련되고, 유지하는 면 방향에서의 압압부(103-1)의 위치 어긋남을 억제하는 에어 베어링(104)을 구비한다.
Bibliography:Application Number: KR20200176111