포토레지스트 박리 조성물

유기 아민을 포함하는 포토레지스트 박리 조성물 및 방법이 제공된다. 유기 아민을 포함하는 포토레지스트 박리 조성물은 하기 화학식 (1)을 갖는다: TIFFpct00020.tif2365 (1) A photoresist stripping composition comprising an organic amine and a method is provided. The photoresist stripping composition comprising an organic amine having the following formula (1)....

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Bibliographic Details
Main Authors MU JIANHAI, JIANG QI, CHEN XUE, JIANG XIN, KING STEPHEN W
Format Patent
LanguageKorean
Published 04.05.2022
Subjects
ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES
APPARATUS SPECIALLY ADAPTED THEREFOR
CANDLES
CHEMISTRY
CINEMATOGRAPHY
DETERGENT COMPOSITIONS
DETERGENTS
ELECTROGRAPHY
FATTY ACIDS THEREFROM
HOLOGRAPHY
MATERIALS THEREFOR
METALLURGY
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
RECOVERY OF GLYCEROL
RESIN SOAPS
SOAP OR SOAP-MAKING
USE OF SINGLE SUBSTANCES AS DETERGENTS
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Summary:유기 아민을 포함하는 포토레지스트 박리 조성물 및 방법이 제공된다. 유기 아민을 포함하는 포토레지스트 박리 조성물은 하기 화학식 (1)을 갖는다: TIFFpct00020.tif2365 (1) A photoresist stripping composition comprising an organic amine and a method is provided. The photoresist stripping composition comprising an organic amine having the following formula (1).
Bibliography:Application Number: KR20227009712