실란트, 실리콘 재료의 수송용 백 및 실리콘 재료의 곤포체

• Main Authors: MOTAI KATSUYUKI, SATO KAZUSHI, NAKAJIMA HIROYOSHI, MIZOSHIRI MAKOTO, TACHIKAWA YUKA
• Format: Patent
• Language: Korean
• Published: 03.05.2022
• Subjects: ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; CONVEYING; DYES; HANDLING THIN OR FILAMENTARY MATERIAL; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PACKAGES; PACKAGING ELEMENTS; PACKING; PAINTS; PERFORMING OPERATIONS; POLISHES; STORING; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

실리콘 재료의 수송용 백에 이용되는 포장 재료는, 제1 수지 기재층과, 배리어층과, 제2 수지 기재층과, 수지층과, 실란트층을 이 순서로 적층하는 적층체이며, 수지층의 압입 탄성률(㎫)은, 제1 수지 기재층 및 제2 수지 기재층의 각각의 압입 탄성률(㎫)보다 1자릿수 이상 작고, 실란트층의 압입 탄성률(㎫)은, 제1 수지 기재층의 압입 탄성률(㎫) 및 제2 수지 기재층의 압입 탄성률(㎫)의 각각보다 1자릿수 이상 작으며, 제1 수지 기재층의 압입 탄성률(㎫)과 제2 수지 기재층의 압입 탄성률(㎫)의 차는, 제2 수지 기재층의 압입 탄성률(㎫)과 수지층의 압입 탄성률(㎫)의 차보다 작다. A packaging material used for a bag for transporting of a silicon material is a laminate in which a first resin base layer, a barrier layer, a second resin base layer, a resin layer, and a sealant layer are laminated in that order, wherein an indentation elastic modulus (MPa) of the resin layer is smaller than an indentation elastic modulus (MPa) of each of the first resin base layer and the second resin base layer by one or more orders of magnitude, an indentation elastic modulus (MPa) of the sealant layer is smaller than an indentation elastic modulus (MPa) of the first resin base layer and an indentation elastic modulus (MPa) of the second resin base layer by one or more orders of magnitude, and a difference between the indentation elastic modulus (MPa) of the first resin base layer and the indentation elastic modulus (MPa) of the second resin base layer is smaller than a difference between the indentation elastic modulus (MPa) of the second resin base layer and the indentation elastic modulus (MPa) of the resin layer.