METHOD APPARATUS AND ASSEMBLY FOR THERMALLY CONNECTING LAYERS

The thermal connection between a die and a top layer is made by applying a thermal interface material (TIM) onto the die, such that the TIM is positioned between the die of an integrated circuit and the top layer of a circuit assembly. The TIM contains an emulsion of liquid metal droplets and an unc...

Full description

Saved in:
Bibliographic Details
Main Authors MAJIDI CARMEL, KAZEM NAVID
Format Patent
LanguageEnglish
Korean
Published 28.04.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:The thermal connection between a die and a top layer is made by applying a thermal interface material (TIM) onto the die, such that the TIM is positioned between the die of an integrated circuit and the top layer of a circuit assembly. The TIM contains an emulsion of liquid metal droplets and an uncured polymer. A method includes a step of deforming the liquid metal droplet by compressing the circuit assembly, and a step of curing the TIM to form the circuit assembly. 열 계면 재료(TIM)가 집적회로의 다이와 회로 조립체의 상부층 사이에 위치되도록 TIM을 다이 상에 적용시킴으로써 다이와 상부층을 열 접속시킨다. TIM은 액체 금속 액적과 미경화 중합체의 에멀션을 포함한다. 방법은 회로 조립체를 압착시킴으로써 액체 금속 액적을 변형시키는 단계 및 열 계면 재료를 경화시킴으로써 회로 조립체를 형성하는 단계를 더 포함한다.
Bibliography:Application Number: KR20220045448