Cavity Printed Circuit Board Manufacturing Method Using Sand Blast
The present invention provides a manufacturing method for uniformly manufacturing a cavity with a side length of 3 mm or less and a depth of 300 μm or more by applying a sand blast method at low production costs, and a printed circuit board comprising the cavity manufactured through the same. The ma...
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| Main Authors | , , |
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| Format | Patent |
| Language | English Korean |
| Published |
19.04.2022
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The present invention provides a manufacturing method for uniformly manufacturing a cavity with a side length of 3 mm or less and a depth of 300 μm or more by applying a sand blast method at low production costs, and a printed circuit board comprising the cavity manufactured through the same. The manufacturing method of the cavity printed circuit board comprises: a first step of first sand blast processing; and a second step of second sand blast processing.
본 발명은 샌드 블라스트 방식을 적용하여 한 변의 길이가 3 mm 이하, 깊이가 300 μm 이상인 캐비티를 균일하게 낮은 생산비용으로 제조하는 제조방법 및 이를 통해서 제조된 캐비티를 포함하는 인쇄회로기판을 제공한다. |
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| AbstractList | The present invention provides a manufacturing method for uniformly manufacturing a cavity with a side length of 3 mm or less and a depth of 300 μm or more by applying a sand blast method at low production costs, and a printed circuit board comprising the cavity manufactured through the same. The manufacturing method of the cavity printed circuit board comprises: a first step of first sand blast processing; and a second step of second sand blast processing.
본 발명은 샌드 블라스트 방식을 적용하여 한 변의 길이가 3 mm 이하, 깊이가 300 μm 이상인 캐비티를 균일하게 낮은 생산비용으로 제조하는 제조방법 및 이를 통해서 제조된 캐비티를 포함하는 인쇄회로기판을 제공한다. |
| Author | KIM BUM SEOK PARK SOO CHUL JEON CHANG JUN |
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| DocumentTitleAlternate | 샌드 블라스트를 이용한 캐비티 인쇄회로기판 제조방법 |
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| Snippet | The present invention provides a manufacturing method for uniformly manufacturing a cavity with a side length of 3 mm or less and a depth of 300 μm or more by... |
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| SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| Title | Cavity Printed Circuit Board Manufacturing Method Using Sand Blast |
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