Cavity Printed Circuit Board Manufacturing Method Using Sand Blast

The present invention provides a manufacturing method for uniformly manufacturing a cavity with a side length of 3 mm or less and a depth of 300 μm or more by applying a sand blast method at low production costs, and a printed circuit board comprising the cavity manufactured through the same. The ma...

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Bibliographic Details
Main Authors PARK SOO CHUL, JEON CHANG JUN, KIM BUM SEOK
Format Patent
LanguageEnglish
Korean
Published 19.04.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present invention provides a manufacturing method for uniformly manufacturing a cavity with a side length of 3 mm or less and a depth of 300 μm or more by applying a sand blast method at low production costs, and a printed circuit board comprising the cavity manufactured through the same. The manufacturing method of the cavity printed circuit board comprises: a first step of first sand blast processing; and a second step of second sand blast processing. 본 발명은 샌드 블라스트 방식을 적용하여 한 변의 길이가 3 mm 이하, 깊이가 300 μm 이상인 캐비티를 균일하게 낮은 생산비용으로 제조하는 제조방법 및 이를 통해서 제조된 캐비티를 포함하는 인쇄회로기판을 제공한다.
Bibliography:Application Number: KR20200131130