SEMICONDUCTOR MODULE
Provided is a semiconductor module comprising a low-side switch, a high-side switch, and a control chip. The low-side switch and the high-side switch are arranged adjacent to each other in a lateral direction and coupled by a switch node connector to form a half-bridge circuit. The switch node conne...
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| Main Authors | , , , , |
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| Format | Patent |
| Language | English Korean |
| Published |
14.04.2022
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| Subjects | |
| Online Access | Get full text |
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| Abstract | Provided is a semiconductor module comprising a low-side switch, a high-side switch, and a control chip. The low-side switch and the high-side switch are arranged adjacent to each other in a lateral direction and coupled by a switch node connector to form a half-bridge circuit. The switch node connector has an arrangement for the low-side switch and the high-side switch and includes two or more branches each having a cross-sectional area. The arrangement and cross-sectional area of the two or more branches are selected to equalize the current density distribution within the switch node connector.
로우측 스위치, 하이측 스위치 및 제어 칩을 포함하는 반도체 모듈이 제공된다. 로우측 스위치와 하이측 스위치는 횡방향으로 서로 인접하게 배열되고, 스위치 노드 커넥터에 의해 결합되어 하프 브리지 회로를 형성한다. 스위치 노드 커넥터는, 로우측 스위치 및 하이측 스위치에 대한 배열을 가지며 단면적을 각각 갖는 둘 이상의 브랜치를 포함한다. 둘 이상의 브랜치의 배열 및 단면적은 스위치 노드 커넥터 내의 전류 밀도 분포를 균일화하도록 선택된다. |
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| AbstractList | Provided is a semiconductor module comprising a low-side switch, a high-side switch, and a control chip. The low-side switch and the high-side switch are arranged adjacent to each other in a lateral direction and coupled by a switch node connector to form a half-bridge circuit. The switch node connector has an arrangement for the low-side switch and the high-side switch and includes two or more branches each having a cross-sectional area. The arrangement and cross-sectional area of the two or more branches are selected to equalize the current density distribution within the switch node connector.
로우측 스위치, 하이측 스위치 및 제어 칩을 포함하는 반도체 모듈이 제공된다. 로우측 스위치와 하이측 스위치는 횡방향으로 서로 인접하게 배열되고, 스위치 노드 커넥터에 의해 결합되어 하프 브리지 회로를 형성한다. 스위치 노드 커넥터는, 로우측 스위치 및 하이측 스위치에 대한 배열을 가지며 단면적을 각각 갖는 둘 이상의 브랜치를 포함한다. 둘 이상의 브랜치의 배열 및 단면적은 스위치 노드 커넥터 내의 전류 밀도 분포를 균일화하도록 선택된다. |
| Author | NOEBAUER GERHARD FEHLER ROBERT KESSLER ANGELA PALM PETTERI YUFEREV SERGEY |
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| Snippet | Provided is a semiconductor module comprising a low-side switch, a high-side switch, and a control chip. The low-side switch and the high-side switch are... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | SEMICONDUCTOR MODULE |
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