POLISHING COMPOSITION METHOD FOR PRODUCING THE SAME POLISHING METHOD AND METHOD FOR PRODUCING SUBSTRATE
An object of the present invention is to provide a means capable of achieving a remarkably high selectivity and a remarkably high step reduction effect between different materials while achieving a high polishing rate for a specific material. A polishing composition according to the present inventio...
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Main Authors | , |
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Format | Patent |
Language | English Korean |
Published |
05.04.2022
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Subjects | |
Online Access | Get full text |
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Summary: | An object of the present invention is to provide a means capable of achieving a remarkably high selectivity and a remarkably high step reduction effect between different materials while achieving a high polishing rate for a specific material. A polishing composition according to the present invention includes silica with organic acid fixed on the surface and polyalkylene glycol, and the polyethylene glycol-equivalent molecular weight distribution of polyalkylene glycol by gel permeation chromatography (GPC) has two or more peaks within a predetermined molecular weight range, at least one of which is a peak derived from polyethylene glycol, and pH is 3 or more and 6 or less.
본 발명은, 특정 재료에 대한 높은 연마 속도를 실현하면서, 이종 재료간에 있어서, 현저하게 높은 선택비 및 현저하게 높은 단차 저감 효과를 실현할 수 있는 수단을 제공한다. 본 발명은, 유기산을 표면에 고정한 실리카와, 폴리알킬렌글리콜을 함유하고, 폴리알킬렌글리콜에 관한 겔 투과 크로마토그래피(GPC)에 의한 폴리에틸렌글리콜 환산의 분자량 분포가 소정의 분자량 범위 내에 2개 이상의 피크를 갖고, 그 중의 적어도 1개는 폴리에틸렌글리콜에서 유래되는 피크이며, pH가 3 이상 6 이하인, 연마용 조성물에 관한 것이다. |
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Bibliography: | Application Number: KR20210108499 |