PARTS COATING DEVICE

The present invention relates to a device for applying coatings onto electronic components configured to rapidly and precisely apply a coating onto an object. The device for applying coatings onto electronic components according to the present invention comprises: a housing unit; a backing unit that...

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Bibliographic Details
Main Author LEE HYUNG KYU
Format Patent
LanguageEnglish
Korean
Published 05.04.2022
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Summary:The present invention relates to a device for applying coatings onto electronic components configured to rapidly and precisely apply a coating onto an object. The device for applying coatings onto electronic components according to the present invention comprises: a housing unit; a backing unit that is embedded in the housing unit and on which an object is seated; a liquid unit that is mounted on the housing unit and provides a liquid for applying a coating onto the object; and a gas unit that is connected to the liquid unit and provides a gas for spraying the object with the liquid supplied from the liquid unit. 본 발명은 부품 도포장치에 관한 것으로서, 하우징부와, 하우징부에 내장되고 대상물이 안착되는 받침부와, 하우징부에 장착되고 대상물에 대한 도포를 위한 액체를 제공하는 액체부와, 액체부에 연결되고 액체부에서 공급되는 액체를 대상물에 분사시키기 위한 기체를 제공하는 기체부를 포함하여, 대상물 도포 작업을 신속하고 정밀하게 실시할 수 있다.
Bibliography:Application Number: KR20200126758