PRINTED CIRCUIT BOARD

The present disclosure relates to a printed circuit board which comprises: an insulating layer; and a first circuit layer which is disposed on an upper surface of the insulating layer. A lower surface of the first circuit layer is in contact with at least a portion of the insulating layer. The first...

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Bibliographic Details
Main Authors JANG JUN HYEONG, HWANG MI SUN, YOO GA YOUNG
Format Patent
LanguageEnglish
Korean
Published 05.04.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present disclosure relates to a printed circuit board which comprises: an insulating layer; and a first circuit layer which is disposed on an upper surface of the insulating layer. A lower surface of the first circuit layer is in contact with at least a portion of the insulating layer. The first circuit layer includes a first region buried in the insulating layer, and a second region protruding from the upper surface of the insulating layer. 본 개시는 절연층; 상기 절연층의 상면에 배치되는 제1 회로층; 을 포함하고, 상기 제1 회로층의 하면은 상기 절연층의 적어도 일부와 접촉하며, 상기 제1 회로층은, 상기 절연층에 매립된 제1 영역 및 상기 절연층의 상면으로부터 돌출되는 제2 영역을 포함하는, 인쇄회로기판에 관한 것이다.
Bibliography:Application Number: KR20200125666