향상된 플라즈마 제어를 위한 EM 소스

PVD 증착 프로세스들 동안 플라즈마 프로파일들을 제어하기 위한 장치 및 방법들이 개시된다. 일부 실시예들은 타겟 위에 배치된 EM 코일들을 활용하여 증착 동안 플라즈마 프로파일을 제어한다. Apparatus and methods for controlling plasma profiles during PVD deposition processes are disclosed. Some embodiments utilize EM coils placed above the target to control the plasma profile duri...

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Bibliographic Details
Main Authors RIKER MARTIN, GUNTHER DAVID, MILLER KEITH A, JANSEN ALEXANDER, KOTHNUR PRASHANTH, SCHOOLEY EMILY
Format Patent
LanguageKorean
Published 17.03.2022
Subjects
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Summary:PVD 증착 프로세스들 동안 플라즈마 프로파일들을 제어하기 위한 장치 및 방법들이 개시된다. 일부 실시예들은 타겟 위에 배치된 EM 코일들을 활용하여 증착 동안 플라즈마 프로파일을 제어한다. Apparatus and methods for controlling plasma profiles during PVD deposition processes are disclosed. Some embodiments utilize EM coils placed above the target to control the plasma profile during deposition.
Bibliography:Application Number: KR20227004920