PRINTED CIRCUIT BOARD AND SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDDED THEREIN

The present invention relates to a printed circuit board, comprising: a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity passing through the second insulating layer, and an electronic component e...

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Bibliographic Details
Main Authors BYUN DAE JUNG, KIM JUNG SOO, HWANG MI SUN, MAENG DUCK YOUNG, LEE JIN WON
Format Patent
LanguageEnglish
Korean
Published 16.03.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present invention relates to a printed circuit board, comprising: a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity passing through the second insulating layer, and an electronic component embedded board comprising the same. The second modulus is greater than the first modulus. An edge portion of the bottom surface of the cavity is made of insulating material. 본 개시는 제1모듈러스를 갖는 제1절연층, 상기 제1절연층 상에 배치되며 제2모듈러스를 갖는 제2절연층, 및 상기 제2절연층을 관통하는 캐비티를 포함하며, 상기 제2모듈러스는 상기 제1모듈러스보다 크며, 상기 캐비티의 바닥면의 모서리 부분이 절연재로 구성되는 인쇄회로기판과, 이를 포함하는 전자부품 내장기판에 관한 것이다.
Bibliography:Application Number: KR20200115386