RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE COPPER CLAD LAMINATE AND CIRCUIT BOARD HAVING THE SAME

• Main Authors: KIM MOO SEONG, LEE JIN SEOK, HWANG MIN YOUNG
• Format: Patent
• Language: English; Korean
• Published: 15.03.2022
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

One embodiment of the present invention relates to a resin composition for a semiconductor package, and more specifically, to a resin composition, a composite of a porous resin comprising a first pore, a glass fiber disposed in the porous resin, and a porous filler disposed in the porous resin and comprising a second pore. In the total volume of the resin composition, the porous filler has a content in a range of 20 and 30 vol% and at least one of the first porosity of the porous resin and the second porosity of the porous filler has a range of 10 to 35%. 실시 예에 따른 반도체 패키지용 수지 조성물은 제1 기공을 포함하는 다공성 레진과, 상기 다공성 레진 내에 배치되는 유리 섬유와, 상기 다공성 레진 내에 배치되는 제2 기공을 포함하는 다공성 필러의 복합체인 수지 조성물이고, 상기 수지 조성물의 전체 볼륨에서 상기 다공성 필러는 20 vol.% 내지 30 vol% 범위의 함량을 가지고, 상기 다공성 레진의 제1 기공율 및 상기 다공성 필러의 제2 기공율 중 적어도 하나는, 10% 내지 35%의 범위를 가진다.