MEHOD OF MANUFACTURING OF PRINTED CIRCUIT BOARD

A printed circuit board according to an embodiment comprises: an insulation layer comprising a via hole; and a via formed in the via hole of the insulation layer, wherein an inner wall of the via hole of the insulation layer has a surface roughness (Ra) in a range of 0.5-1.0 μm. Therefore, the prese...

Full description

Saved in:
Bibliographic Details
Main Authors KIM MOO SEONG, LEE JIN SEOK, HWANG MIN YOUNG
Format Patent
LanguageEnglish
Korean
Published 15.03.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:A printed circuit board according to an embodiment comprises: an insulation layer comprising a via hole; and a via formed in the via hole of the insulation layer, wherein an inner wall of the via hole of the insulation layer has a surface roughness (Ra) in a range of 0.5-1.0 μm. Therefore, the present invention is capable of improving product reliability. 실시 예에 따른 인쇄회로기판은 비아 홀을 포함하는 절연층; 및 상기 절연층의 비아 홀 내에 형성되는 비아를 포함하고, 상기 절연층의 상기 비아 홀의 내벽은, 0.5㎛ 내지 1.0㎛ 범위의 표면 거칠기(Ra)를 가진다.
Bibliography:Application Number: KR20200113658