필름, 적층체, 필름층 부착 반도체 웨이퍼, 필름층 부착 반도체 탑재용 기판, 및 반도체 장치

• Main Authors: OKANIWA MASASHI, SUGIYAMA GENKI, SEKIDO TAKAHITO, KIDA TSUYOSHI, TAKANO KENTARO
• Format: Patent
• Language: Korean
• Published: 11.03.2022
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

분자 내의 말단에 하기 식 (1) 로 나타내는 구성 단위를 포함하는, 프로페닐기 함유 수지 (A) 와, 상기 프로페닐기 함유 수지 (A) 이외의, 라디칼 중합성 수지 또는 화합물 (B) 와, 경화 촉진제 (C) 를 포함하고, 상기 라디칼 중합성 수지 또는 화합물 (B) 가, 말레이미드기 및 시트라콘이미드기로 이루어지는 군에서 선택되는 적어도 1 종을 포함하는, 필름. TIFFpct00081.tif3061 식 (1) 중, -* 는, 결합손을 나타낸다. A film containing: a propenyl group-containing resin (A) including, at an end of a molecule, a constituent unit represented by the following formula (1); a radical polymerizable resin or compound (B) other than the propenyl group-containing resin (A); and a curing accelerator (C), wherein the radical polymerizable resin or compound (B) includes at least one selected from the group consisting of a maleimide group and a citraconimide group. In the formula (1), -* represents a bonding hand.