EMI EMI shielding lightweight conductive foam and manufacturing method of that

• Main Authors: CHOI KWANG SIK, YOO JONG GYEONG
• Format: Patent
• Language: English; Korean
• Published: 11.03.2022
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

The present invention relates to a lightweight conductive foam for EMI shielding prepared through a step of mixing a foamed resin and a carbon nanotube to prepare a carbon nanotube resin compound; a step of extruding the carbon nanotube resin compound to prepare a pellet; a supercritical carbon diox...