EMI EMI shielding lightweight conductive foam and manufacturing method of that

• Main Authors: CHOI KWANG SIK, YOO JONG GYEONG
• Format: Patent
• Language: English; Korean
• Published: 11.03.2022
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

The present invention relates to a lightweight conductive foam for EMI shielding prepared through a step of mixing a foamed resin and a carbon nanotube to prepare a carbon nanotube resin compound; a step of extruding the carbon nanotube resin compound to prepare a pellet; a supercritical carbon dioxide foaming step of foaming the pellet; and a step of steaming and molding the foamed pellet to prepare a foamed resin foam. The foam for EMI shielding for solving the problem of the foam for EMI shielding according to the present invention and a preparation method thereof maximize an EMI shielding effect while maintaining lightness and can secure the ease of molding. 본 발명은, 발포 수지와 탄소나노튜브를 배합하여 탄소나노튜브 수지화합물을 생성하는 단계, 탄소나노튜브 수지화합물을 압출하여 펠렛을 생성하는 단계, 펠렛을 발포하는 초임계 이산화탄소 발포 단계 및 발포된 펠렛을 증기성형하여 발포수지폼을 생성하는 단계를 통하여 생성되는 EMI 차폐용 경량 전도성 폼에 관한 것이다. 본 발명에 따른 EMI 차폐용 폼의 문제점을 해결하기 위한 EMI 차폐용 폼 및 이의 제조 방법은 경량성을 유지하면서 EMI 차폐효과를 극대화 시키며, 성형 용이성을 확보할 수 있는 효과가 있다.