LASER PROCESSING DEVICE

A laser processing device for processing an object to be processed disposed on a stage using a laser beam comprises: a laser generator that generates a laser beam; a laser scanner that controls a traveling path of the laser beam; a laser optical system that adjusts the traveling path of the laser be...

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Bibliographic Details
Main Authors YEON SEONG JIN, VORONOV ALEXANDER, AHN JOO SEOB, HAN GYOO WAN, PARK JUN HO
Format Patent
LanguageEnglish
Korean
Published 11.03.2022
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A laser processing device for processing an object to be processed disposed on a stage using a laser beam comprises: a laser generator that generates a laser beam; a laser scanner that controls a traveling path of the laser beam; a laser optical system that adjusts the traveling path of the laser beam to be perpendicular to the stage; and a diffractive optical element disposed between the laser optical system and the object to be processed and splitting the laser beam into a plurality of diffracted beams. 레이저 빔을 이용하여 스테이지 상에 배치되는 가공 대상물을 가공하는 레이저 가공 장치는 레이저 빔을 발생시키는 레이저 발생기, 레이저 빔의 진행 경로를 조절하는 레이저 스캐너, 레이저 빔의 진행 경로를 스테이지와 수직하도록 조절하는 레이저 광학계, 및 레이저 광학계 및 가공 대상물 사이에 배치되고 레이저 빔을 복수의 회절 빔들로 분할하는 회절 광학 소자를 포함한다.
Bibliography:Application Number: KR20200110645