Wiring material for semiconductor device wiring for semiconductor device including the same and semiconductor device including the wiring

A wiring material for a semiconductor element comprising one or more metals selected from groups 2 to 14 elements and a boride compound containing boron, a wiring for a semiconductor element including the same, and a semiconductor device including a wiring containing the wiring material are provided...

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Bibliographic Details
Main Authors KANG, YOUNG JAE, YOON, DU SEOP, YOO, JOUNG EUN
Format Patent
LanguageEnglish
Korean
Published 08.03.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A wiring material for a semiconductor element comprising one or more metals selected from groups 2 to 14 elements and a boride compound containing boron, a wiring for a semiconductor element including the same, and a semiconductor device including a wiring containing the wiring material are provided. Excellent reliability can be maintained even in downscaling of semiconductor elements. 2족 내지 14족 원소 중에서 선택된 하나 이상의 금속 및 보론을 함유한 보라이드계 화합물을 포함하는 반도체 소자용 배선재료, 이를 포함하는 반도체 소자용 배선 및 상기 배선재료를 함유하는 배선을 포함한 반도체 소자가 제시된다.
Bibliography:Application Number: KR20200110591