SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

A semiconductor package includes: a package substrate; a first pad pattern disposed on the package substrate, having a first surface and a second surface opposite to the first surface, exposed to the first surface, and having a first width; and an interposer having a plurality of bonding pads formed...

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Main Authors KIM BYEONG CHAN, JIN JEONG GI, SONG SOL JI, AN JIN HO, PARK JUM YONG, LEE CHUNG SUN, CHOI JU IL
Format Patent
LanguageEnglish
Korean
Published 25.02.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package includes: a package substrate; a first pad pattern disposed on the package substrate, having a first surface and a second surface opposite to the first surface, exposed to the first surface, and having a first width; and an interposer having a plurality of bonding pads formed on the first pad pattern and having a second pad pattern having a second width greater than the first width; and first and second semiconductor devices disposed on the interposer. 반도체 패키지는 패키지 기판, 상기 패키지 기판 상에 배치되고, 제1 면 및 상기 제1 면에 반대하는 제2 면을 가지며, 상기 제1 면에 노출되도록 구비되며 제1 폭을 갖는 제1 패드 패턴 및 상기 제1 패드 패턴 상에 상기 제1 폭보다 큰 제2 폭을 갖는 제2 패드 패턴을 갖는 복수개의 본딩 패드들을 갖는 인터포저, 상기 인터포저 상에 서로 배치되는 제1 및 제2 반도체 장치들을 포함한다.
Bibliography:Application Number: KR20200103126