APPARATUS FOR TREATING SUBSTRATE AND UNIT FOR SUPPORTING SUBSTRATE

• Main Authors: KIM SUNG JE, KIM DONG SUK, OGSEN GALSTYAN, AN JONG HWAN, BAE MIN KEUN, CHO JAE HYUN, LEE WON SEOK, KIM HYEON GYU, SON HYOUNGKYU
• Format: Patent
• Language: English; Korean
• Published: 16.02.2022
• Subjects: BASIC ELECTRIC ELEMENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; MACHINE TOOLS; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TRANSPORTING

The present invention provides a support unit provided in a device for processing a substrate using plasma. In one embodiment, the substrate support unit includes: a dielectric plate on which the substrate is placed; a lower electrode disposed under the dielectric plate and having a first diameter; a power supply rod applying RF power to the lower electrode and having a second diameter; and a ground member disposed under the lower electrode to be spaced apart from the lower electrode by a first interval by an insulating member, and including a plate portion having a through hole having a third diameter through which the power supply rod passes in the center. 본 발명은 플라즈마를 이용하여 기판을 처리하는 장치에 제공되는 지지 유닛을 제공한다. 일 실시 예에 있어서, 기판 지지 유닛은, 기판이 놓이는 유전판과; 상기 유전판 아래에 배치되고 제1 직경을 갖는 하부 전극과; 상기 하부 전극에 RF 전력을 인가하고 제2 직경을 갖는 전력 공급 로드와; 상기 하부 전극의 하부에 상기 하부 전극과 절연 부재에 의해 제1 간격 이격되어 배치되며, 중앙에 상기 전력 공급 로드가 관통하는 제3 직경을 갖는 관통홀이 형성된 플레이트부를 포함하는 접지 부재를 포함한다.