Heat dissipation composite lower panel sheet and display device including the same

• Main Authors: YOU JUN WOO, KIM HYUK HWAN, LEE JEONG IN
• Format: Patent
• Language: English; Korean
• Published: 04.02.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

An objective of the present invention is to provide a heat dissipation composite with the maximized heat dissipation characteristics. The heat dissipation composite comprises: a heat dissipation layer; a thermoelectric element layer disposed on the heat dissipation layer; and a piezoelectric element layer disposed on the thermoelectric element layer. The thermoelectric element layer is configured to convert heat provided from the heat dissipation layer into electricity. The piezoelectric element layer is configured to change the electricity provided from the thermoelectric element layer into vibration. 방열 복합체는 방열층; 상기 방열층 상에 배치된 열전 소자층; 및 상기 열전 소자층 상에 배치된 압전 소자층을 포함하되, 상기 열전 소자층은 상기 방열층으로부터 제공된 열을 전기로 변화시키도록 구성되고, 상기 압전 소자층은 상기 열전 소자층으로부터 제공된 상기 전기를 진동으로 변화시키도록 구성된다.