LASER BONDED DEVICES LASER BONDING TOOLS AND RELATED METHODS
The present disclosure provides a bonding tool and a method for bonding a semiconductor device. In one embodiment of the present invention, a system may comprise a laser assisted bonding (lab) tool that includes a stage block and a laser source opposite the stage block. The stage block may be config...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English Korean |
Published |
30.12.2021
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Subjects | |
Online Access | Get full text |
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