LASER BONDED DEVICES LASER BONDING TOOLS AND RELATED METHODS

The present disclosure provides a bonding tool and a method for bonding a semiconductor device. In one embodiment of the present invention, a system may comprise a laser assisted bonding (lab) tool that includes a stage block and a laser source opposite the stage block. The stage block may be config...

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Bibliographic Details
Main Authors SONG YUN SEOK, PARK DONG HYEON, KIM MIN HO, RYU DONG SU, JU WOO KYUNG, NA SEOK HO, KIM CHOONG HOE
Format Patent
LanguageEnglish
Korean
Published 30.12.2021
Subjects
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