SUBSTRATE FIXING DEVICE ELECTROSTATIC CHUCK AND METHOD OF MANUFACTURING ELECTROSTATIC CHUCK

A substrate fixing device is provided. The substrate fixing device includes: a base plate; and an electrostatic chuck fixed to the base plate and configured to suck an object by electrostatic force. The electrostatic chuck includes: an adsorption layer configured to adsorb and hold the object; and a...

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Bibliographic Details
Main Authors TAKEMOTO KEIICHI, HARAYAMA YOICHI
Format Patent
LanguageEnglish
Korean
Published 23.12.2021
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Summary:A substrate fixing device is provided. The substrate fixing device includes: a base plate; and an electrostatic chuck fixed to the base plate and configured to suck an object by electrostatic force. The electrostatic chuck includes: an adsorption layer configured to adsorb and hold the object; and a heater layer provided between the adsorption layer and the base plate and configured to heat the object held by the adsorption layer. The thickness of the heater layer is uniform over the entire area of the heater layer. 기판 고정 장치가 제공된다. 기판 고정 장치는 베이스 플레이트; 및 베이스 플레이트에 고정되고 정전기력에 의해 대상물을 흡착하도록 구성된 정전 척을 포함한다. 정전 척은, 대상물을 흡착 유지하도록 구성된 흡착층; 및 흡착층과 베이스 플레이트 사이에 마련되고 흡착층에 의해 유지된 대상물을 가열하도록 구성된 히터층을 포함한다. 히터층의 두께는 히터층의 전체 영역에 걸쳐 균일하다.
Bibliography:Application Number: KR20210074629