REDISTRIBUTION STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

Provided is a semiconductor device having a redistribution structure and a method for forming the same. The semiconductor device comprises: a semiconductor structure; a redistribution structure over the semiconductor structure and electrically coupled to the semiconductor structure; and a connector...

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Bibliographic Details
Main Authors HU YU HSIANG, WANG PO HAN, KUO HUNG JUI
Format Patent
LanguageEnglish
Korean
Published 23.12.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Provided is a semiconductor device having a redistribution structure and a method for forming the same. The semiconductor device comprises: a semiconductor structure; a redistribution structure over the semiconductor structure and electrically coupled to the semiconductor structure; and a connector over the redistribution structure and electrically coupled to the redistribution structure. The redistribution structure includes a base via and a stack via electrically interposed between the base via and the connector. The stacked via is laterally spaced from the base via. 재배선 구조체를 갖는 반도체 디바이스 및 그 형성 방법이 제공된다. 반도체 디바이스는 반도체 구조체, 반도체 구조체 위에 있으며 반도체 구조체에 전기적으로 커플링되는 재배선 구조체, 및 재배선 구조체 위에 있으며 재배선 구조체에 전기적으로 커플링되는 커넥터를 포함한다. 재배선 구조체는 베이스 비아 및 베이스 비아와 커넥터 사이에서 전기적으로 개재되는 스택 비아를 포함한다. 적층된 비아는 베이스 비아로부터 측방향으로 이격된다.
Bibliography:Application Number: KR20210005882