니켈 또는 코발트 합금을 사용한 3Ｄ ＮＡＮＤ 제조 방법

• Main Authors: SUHR DOMINIQUE, MEVELLEC VINCENT, THIAM MIKAILOU
• Format: Patent
• Language: Korean
• Published: 10.12.2021
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

본 발명은 특히 3D NAND 메모리의 제조를 위해 의도된 반도체 기판을 금속화하는 프로세스에 관한 것이다. 이 금속화 프로세스는 팔라듐과 같은 귀금속으로 유전체 물질의 표면을 활성화하는 단계와, 이어서, 금속 이온을 포함하는 용액을 사용하는 무전해 프로세스에 의해 니켈 또는 코발트 합금을 침전하는 단계를 포함한다. The invention relates to a process for metallizing a semiconductor substrate intended in particular for the fabrication of a 3D NAND memory. This metallization process comprises a step of activating the surface of a dielectric material with a noble metal such as palladium, followed by a step of depositing a nickel or cobalt alloy by an electroless process using a solution comprising metal ions.