CONDUCTIVE PARTICLE ANISOTROPIC CONDUCTIVE ADHESIVE CONNECTING STRUCTURE AND METHOD FOR PRODUCING CONDUCTIVE PARTICLE

• Main Authors: MATSUZAWA MITSUHARU, MATSUZAKI TOSHIAKI, ENOMOTO NANA, EJIRI YOSHINORI, WATANABE YASUSHI, NAKAGAWA MASASHI, AKAI KUNIHIKO, YAMAMURA TAIZOU
• Format: Patent
• Language: English; Korean
• Published: 09.12.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CONDUCTORS; DYES; ELECTRICITY; INSULATORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS AS ADHESIVES

Provided is a conductive particle, an anisotropic conductive adhesive which can achieve both low conduction resistance and high insulation reliability when used as conductive particles blended into anisotropic conductive adhesives and can maintain a low electrical resistance value even when highly compressed, a connection structure, and a manufacturing method thereof. According to the present invention, the conductive particle comprises a resin particle and a metal layer installed on the surface of the resin particle. The metal layer includes a first layer including copper or nickel and copper and a second layer including nickel in the order close to the resin particle. The metal layer includes grains containing palladium having a length of 4 nm or more in the thickness direction of the metal layer and a projection is formed on the outer surface of the metal layer. 이방 도전성 접착제에 배합되는 도전 입자로서 사용되었을 때에 낮은 도통 저항과 높은 절연 신뢰성을 양립할 수 있고, 또한 고압축되었을 경우에도 낮은 전기 저항값을 유지할 수 있는 도전 입자, 상기 도전 입자를 사용한 이방 도전성 접착제 및 접속 구조체, 및 도전 입자의 제조 방법을 제공한다. 이 도전 입자는, 수지 입자와, 상기 수지 입자의 표면에 설치된 금속층을 구비하고, 금속층은, 수지 입자에 가까운 순서대로, 구리, 또는 니켈 및 구리를 포함하는 제1층과, 니켈을 포함하는 제2층을 갖고, 금속층의 두께 방향에서의 길이가 4nm 이상인 팔라듐을 포함하는 알갱이를 함유하고, 금속층의 외표면에는 돌기가 형성되어 있다.