APPARATUS FOR DEPOSITING PARTICLE AND METHOD FOR MANUFACTURING A STANDARD WAFER

A method for manufacturing a standard wafer comprises the steps of: forming aerosolized contaminant particles from a colloid comprising contaminant particles; removing moisture from the aerosolized contaminant particles; allowing the contaminant particles having no moisture to have a constant electr...

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Bibliographic Details
Main Authors KIM TAESUNG, HONG SEOKJUN, LEE SEUNGJAE, OH HAE RIM
Format Patent
LanguageEnglish
Korean
Published 02.12.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for manufacturing a standard wafer comprises the steps of: forming aerosolized contaminant particles from a colloid comprising contaminant particles; removing moisture from the aerosolized contaminant particles; allowing the contaminant particles having no moisture to have a constant electric charge; classifying the contaminant particles adjusted to have a constant charge into contaminant particles having a predetermined size and a predetermined charge; and depositing the classified contaminant particles to the wafer. The depositing is performed while the standard wafer is rotated. 표준 웨이퍼 제조 방법은, 오염 입자를 포함하는 콜로이드로부터 에어로졸화된 오염 입자를 형성하는 단계와; 상기 에어로졸화된 오염 입자의 수분을 제거하는 단계와; 상기 수분이 제거된 오염 입자가 일정한 전하를 갖도록 하는 단계와; 상기 일정한 전하를 갖도록 조절된 오염 입자를 일정 크기 및 일정 전하를 갖는 오염 입자로 분류하는 단계와; 상기 분류된 오염 입자를 웨이퍼에 도포하는 단계를 포함하되, 상기 도포는 상기 표준 웨이퍼가 회전하는 상태에서 이루어진다.
Bibliography:Application Number: KR20200062245