High density printed circuit board with plating layer and manufacturing method thereof

• Main Authors: CHOI DONG HYUCK, CHUNG BO MOOK, PARK JAE SEUNG, CHUN, SUNG WOOK
• Format: Patent
• Language: English; Korean
• Published: 18.10.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The present invention provides a high-density printed circuit board formed with a plating layer, which comprises: a copper layer formed on a printed circuit board; a silver plating layer formed in an upper part of the copper layer and including a silver component; a palladium plating layer formed in...