High density printed circuit board with plating layer and manufacturing method thereof

The present invention provides a high-density printed circuit board formed with a plating layer, which comprises: a copper layer formed on a printed circuit board; a silver plating layer formed in an upper part of the copper layer and including a silver component; a palladium plating layer formed in...

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Bibliographic Details
Main Authors CHOI DONG HYUCK, CHUNG BO MOOK, PARK JAE SEUNG, CHUN, SUNG WOOK
Format Patent
LanguageEnglish
Korean
Published 18.10.2021
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present invention provides a high-density printed circuit board formed with a plating layer, which comprises: a copper layer formed on a printed circuit board; a silver plating layer formed in an upper part of the copper layer and including a silver component; a palladium plating layer formed in an upper part of the silver plating layer and including a palladium component; and a gold plating layer formed on the palladium plating layer and including a gold component. 인쇄회로기판에 형성된 구리층; 상기 구리층 상부에 형성되어 있으며 은 성분을 포함하는 은 도금층; 상기 은 도금층의 상부에 형성되어 있으며 팔라듐 성분을 포함하는 팔라듐 도금층; 및 상기 팔라듐 도금층 상부에 형성되어 있으며 금 성분을 포함하는 금 도금층을 포함하는 도금층이 형성된 고밀도 인쇄회로기판이 제공된다.
Bibliography:Application Number: KR20210045276