PACKAGED DEVICE WITH OPTICAL PATHWAY

A packaged device includes an optical IC having an optical feature unit therein. An interconnect structure comprises a layer of a conductive feature unit embedded within each layer of a dielectric material. The interconnect structure is on the optical feature unit. The interconnect structure is patt...

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Bibliographic Details
Main Authors CHEN HSIEN WEI, CHEN MING FA
Format Patent
LanguageEnglish
Korean
Published 08.10.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A packaged device includes an optical IC having an optical feature unit therein. An interconnect structure comprises a layer of a conductive feature unit embedded within each layer of a dielectric material. The interconnect structure is on the optical feature unit. The interconnect structure is patterned to eliminate the interconnect structure from an upper portion of the optical feature unit. A dielectric material having properties, which are optically neutral to a desired light wavelength(s), is formed on the optical feature unit. One or more electronic ICs may be bonded to an optical IC to form an integrated package. 패키징된 디바이스는 그 안에 광학 특징부를 갖는 광학 IC를 포함한다. 유전체 재료의 각자의 층 내에 매립된 전도성 특징부의 층을 포함하는 상호접속 구조물이 광학 특징부 위에 있다. 상호접속 구조물은 광학 특징부 위로부터 상호접속 구조물을 제거하도록 패터닝되며, 원하는 광 파장(들)에 대해 광학적으로 중립적인 특성을 갖는 유전체 재료가 광학 특징부 위에 형성된다. 집적 패키지를 형성하도록 광학 IC에 하나 이상의 전자 IC가 본딩될 수 있다.
Bibliography:Application Number: KR20200174201