PROCESSING METHOD OF A WAFER
An objective of the present invention is to provide a wafer processing method capable of preventing damage to a device adjacent to an outer peripheral surplus region of a wafer. The wafer processing method includes: a protective member configuration step for configuring a protective member (14) on a...
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Main Author | |
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Format | Patent |
Language | English Korean |
Published |
07.10.2021
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Subjects | |
Online Access | Get full text |
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