DIE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

An object of the present invention is to provide a die bonding apparatus capable of further miniaturizing a device in a push-up unit. The die bonding apparatus comprises a push-up unit that has a plurality of blocks in contact with the dicing tape and pushes up a die from below the dicing tape, a co...

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Bibliographic Details
Main Authors NAKUI YUKI, SAITO AKIRA, IKARASHI ITSUKI
Format Patent
LanguageEnglish
Korean
Published 06.10.2021
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:An object of the present invention is to provide a die bonding apparatus capable of further miniaturizing a device in a push-up unit. The die bonding apparatus comprises a push-up unit that has a plurality of blocks in contact with the dicing tape and pushes up a die from below the dicing tape, a collet for adsorbing the die, and a control part configured to control the push-up unit. The push-up unit includes a plurality of drive shafts independently operated corresponding to the plurality of blocks, and a plurality of motors corresponding to the plurality of drive shafts. The control part is configured to measure the peeling force of the die by measuring a torque value for each motor. 밀어올림 유닛 내의 기구를 보다 소형화할 수 있는 다이 본딩 장치를 제공하는 것이다. 다이 본딩 장치는, 다이싱 테이프와 접촉하는 복수의 블록을 갖고, 다이를 상기 다이싱 테이프의 아래로부터 밀어올리는 밀어올림 유닛과, 다이를 흡착하는 콜릿과, 밀어올림 유닛을 제어하도록 구성되는 제어부를 구비한다. 밀어올림 유닛은, 복수의 상기 블록에 대응하여 독립적으로 동작하는 복수의 구동축과, 복수의 구동축에 대응하는 복수의 모터를 구비하고, 제어부는 상기 모터마다 토크값을 측정함으로써 상기 다이의 박리력을 측정하도록 구성된다.
Bibliography:Application Number: KR20210024557