고열전도성 실리콘 조성물 및 그 제조 방법

• Main Author: MARUYAMA NARIMI
• Format: Patent
• Language: Korean
• Published: 05.10.2021
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

(A) 규소 원자에 결합한 알케닐기를 가지는 오가노폴리실록산과, (B) 규소 원자에 결합한 수소 원자(Si-H기)를 가지는 오가노하이드로젠폴리실록산을, (Si-H/Si-Vi) 8.0을 초과하고 20.0 이하에서 반응시킨 반응물인 오가노폴리실록산, (C) 금속 산화물 및 금속 질화물로부터 선택되는 평균 입경 3㎛ 이하의 무기 충전재, 및 (D) 평균 입경 5㎛ 이상의 열전도성 무기 충전재를 함유하는 실리콘 조성물로서, (C) 성분과 (D) 성분의 합계량이 (A) 성분과 (B) 성분의 합계 100질량부에 대하여 3,500∼12,000질량부이고, 이 조성물의 열전도율이 4W/m·K 이상이며, 절대 점도가 100∼1,000Pa·s인 실리콘 조성물로 함으로써, 내크리프성과 도포성이 우수한 고열전도성 실리콘 조성물 및 그 제조 방법을 제공하는 것을 목적으로 한다. The purpose of the present invention is to provide a highly thermally conductive silicone composition that exhibits excellent displacement resistance and coatability by forming a silicone composition that contains: an organopolysiloxane that is a product of a reaction between (A) an organopolysiloxane having an alkenyl group bonded to a silicon atom and (B) an organohydrogenpolysiloxane having a hydrogen atom bonded to a silicon atom (a Si-H group) at quantities whereby the (Si-H/Si-Vi) ratio is more than 8.0 and not more than 20.0; (C) an inorganic filler having an average particle diameter of 3 µm or less which is selected from among metal oxides and metal nitrides; and (D) a thermally conductive inorganic filler having an average particle diameter of 5 µm or more. The total amount of component (C) and component (D) is 3,500-12,000 parts by mass relative to a total of 100 parts by mass of component (A) and component (B), and the composition has a thermal conductivity of 4 W/m·K or more and an absolute viscosity of 100-1,000 Pa·s. A further purpose of the present invention is to provide a method for producing the highly thermally conductive silicone composition.