부가 경화성 실리콘 접착제 조성물

• Main Authors: OTASHIRO KOKI, GUPTA MANAV, MANDAL SUBRATA
• Format: Patent
• Language: Korean
• Published: 01.10.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

접착 촉진제를 포함하여 구성되는 경화성 실리콘 접착제 조성물이 본 명세서에 제시되고 기술된다. 그 접착 촉진제는, 비교적 낮은 온도와 더 짧은 시간에 경화 가능한 실리콘 물질을 제공하기 위해, 다른 접착 촉진제와 함께 방향족 기반 골격을 포함하는 규소 하이드라이드 물질이고, 플라스틱 및 금속에 대한 우수한 접착력을 제공한다. A curable silicone adhesive composition comprising adhesion promoter is shown and described herein. The adhesion promoter is a silicon hydride material containing an aromatic based skeleton with another adhesion promoter to provide a silicone material that is curable at relatively low temperatures and shorter time and provides good adhesion to plastics and metal.