Evaporative source

• Main Authors: SEO HYUN, HONG YE WON, JUNG EUNSANG, CHOI, MYUNG WOON, KANG HYUN HO, PARK EUN SIK, NA YOUNGHYUCK, CHO DAE SUNG
• Format: Patent
• Language: English; Korean
• Published: 27.09.2021
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

An object of the present invention is to prevent spitting occurring in an evaporation source. According to the above object, the present invention removes spitting by applying a metal mesh woven to have fine openings to the evaporation source. The metal mesh may have a uniform opening size or a mixture of different openings. In addition, the metal mesh can be applied in multiple layers and because of its flexibility, can be arranged in various shapes and can be attached and detached as needed in various places of the evaporation source. 본 발명의 목적은 증착원에서 일어나는 스피팅 현상을 방지하고자 하는 것이다. 상기 목적에 따라 본 발명은 미세 개구부를 갖도록 짜여진 금속 망사를 증착원에 적용하여 스피팅 현상을 제거하였다.