METHOD FOR PREPARING AND/OR PERFORMING THE SEPARATION OF A SUBSTRATE ELEMENT AND SUBSTRATE SUB-ELEMENT

• Main Authors: ORTNER ANDREAS, SOHR DAVID, WAGNER FABIAN
• Format: Patent
• Language: English; Korean
• Published: 16.09.2021
• Subjects: CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; GLASS; MACHINE TOOLS; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MINERAL OR SLAG WOOL; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The present invention relates to a method for preparing and/or performing separation of a substrate element into at least two substrate subelements along a separation plane, and particularly, to the substrate subelements which are manufactured and/or can be manufactured by using a method according to the present invention. The method of the present invention comprises: a provision step; and a control step. 본 발명은 분리면을 따라 적어도 2개의 기판 서브엘리먼트로의 기판 엘리먼트의 분리를 준비 및/또는 수행하기 위한 방법 및 특히 본 발명에 따른 방법을 사용하여 제조되고 그리고/또는 제조될 수 있는 기판 서브엘리먼트에 관한 것이다.