HEATSINK CUTOUT AND INSULATING THROUGH SILICON VIAS TO CUT THERMAL CROSS-TALK

Embodiments disclosed in the present specification include an electronic package. In one embodiment of the present specification, the electronic package includes an interposer, a first die attached to the interposer, and a second die attached to the interposer. In one embodiment, the electronic pack...

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Bibliographic Details
Main Authors WAN ZHIMIN, CHIU CHIA PIN, JHA MOHAN CHANDRA
Format Patent
LanguageEnglish
Korean
Published 17.08.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Embodiments disclosed in the present specification include an electronic package. In one embodiment of the present specification, the electronic package includes an interposer, a first die attached to the interposer, and a second die attached to the interposer. In one embodiment, the electronic package further includes a heatsink thermally coupled to the first die and the second die. In one embodiment, the heatsink has a first surface facing away from the first and second dies and a second surface facing the first and second dies. In one embodiment, the heatsink includes a thermal break between the first die and the second die. An objective of the present invention is to reduce thermal cross-talk. 본 명세서에 개시된 실시예는 전자 패키지를 포함한다. 일 실시예에서, 전자 패키지는 인터포저, 인터포저에 부착된 제 1 다이, 및 인터포저에 부착된 제 2 다이를 포함한다. 일 실시예에서, 전자 패키지는 제 1 다이 및 제 2 다이에 열적으로 결합된 히트싱크를 더 포함한다. 일 실시예에서, 히트싱크는 제 1 다이와 제 2 다이로부터 먼 쪽을 향하는 제 1 표면 및 제 1 다이와 제 2 다이를 향하는 제 2 표면을 갖는다. 일 실시예에서, 히트싱크는 제 1 다이와 제 2 다이 사이의 열 브레이크를 포함한다.
Bibliography:Application Number: KR20200183981